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Proceedings Paper

Novolac Based Deep-UV Resists
Author(s): Dennis R. McKean; Scott A. MacDonald; Nicholas J. Clecak; C. Grant Willson
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Paper Abstract

This paper describes the results obtained from studies of deep-UV lithographic properties of resists which utilize chemical amplification in novolac resins. These studies have shown that three-component novolac-based systems are surprisingly effective as deep-UV resists despite the high opacity of novolac at 254 nm. Analytical results are described which have measured the amount of Bronsted acid produced in chemical amplification resist films. The minimum acid concentration necessary for acceptable dissolution rates is far less than the corresponding active species content necessary for the proper functioning of diazoketone-novolac deep-UV resists.

Paper Details

Date Published: 1 January 1988
PDF: 7 pages
Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968302
Show Author Affiliations
Dennis R. McKean, IBM (United States)
Scott A. MacDonald, IBM (United States)
Nicholas J. Clecak, IBM (United States)
C. Grant Willson, IBM (United States)

Published in SPIE Proceedings Vol. 0920:
Advances in Resist Technology and Processing V
Scott A. MacDonald, Editor(s)

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