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Proceedings Paper

Mid-UV Photoresists Combining Chemical Amplification And Dissolution Inhibition
Author(s): Michael J. O'Brien; James V. Crivello
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Paper Abstract

This paper describes the development of mid-UV photoresist materials based on the combined principles of chemical amplification and dissolution inhibition. These resists are composed of a novolac resin, a dissolution inhibitor containing an acid labile blocking group, and a photosensitive onium salt. A positive image is obtained by exposure to mid-UV irradiation, which generates a strong Bronsted acid from the onium salt, heating the resist so that the acid can catalyze deblocking of the acid labile groups on the dissolution inhibitor, and finally development with aqueous base. Interestingly, this system works well despite the fact that novolacs have previously been shown to become insolubilized by heating them in the presence of onium salt photoproducts.

Paper Details

Date Published: 1 January 1988
PDF: 9 pages
Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); doi: 10.1117/12.968300
Show Author Affiliations
Michael J. O'Brien, General Electric Corporate Research and Development Center (United States)
James V. Crivello, General Electric Corporate Research and Development Center (United States)


Published in SPIE Proceedings Vol. 0920:
Advances in Resist Technology and Processing V
Scott A. MacDonald, Editor(s)

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