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Proceedings Paper

A High Performance Packaging Technology To Match Optical Transmission
Author(s): Eric Bogatin; Paul Sherlock
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Paper Abstract

To even attempt to match the bandwidth capability of fiber optic transmission, electronics must be designed with the fastest chips and the next generation packaging- the multichip module. While individual chip packages are a convenience for testing and in handling with clumsy fingers, they are detrimental to system performance. They demand long path lengths, frequently using materials of high dielectric constant, and often create impedance mismatches. The next generation multichip substrates developed and manufactured by Raychem Corporation, cut path lengths typically 4 :1 and allow interconnect densities of more than 500 in/sq.in of board. They are constructed from multilayer thin film metal lines less than 25μ wide and a polymer insulation. The precision thin film technique provides chip attach footprints that can match the chip I/O, resulting in low bonding parasitics. The electrical properties are very well described by traditional models for planar interconnects, and agree with the actual measurements up to 10 GHz, the limit of reliable data. These generic substrates will help bridge the "impedance mismatch" between the transmission bandwidth of fibers and the information exchange bandwidth of digital electronics.

Paper Details

Date Published: 1 January 1987
PDF: 13 pages
Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); doi: 10.1117/12.967553
Show Author Affiliations
Eric Bogatin, Raychem Corporation (United States)
Paul Sherlock, Raychem Corporation (United States)


Published in SPIE Proceedings Vol. 0836:
Optoelectronic Materials, Devices, Packaging, and Interconnects
Theodore E. Batchman; Richard Franklin Carson; Robert L. Galawa; Henry J. Wojtunik, Editor(s)

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