Share Email Print

Proceedings Paper

Critical Issues In Free Space Intrachip Optical Interconnect Technology
Author(s): Michael R. Feldman; Sadik C. Esener; Clark C. Guest; Sing H. Lee
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Conditions are determined for which free space optical interconnects can transmit information at a higher data rate and consume less power than the equivalent electrical interconnections. Effects of circuit dimension scaling and improved optical link efficiency are discussed. The packing densities of optical and electrical interconnects are also compared.

Paper Details

Date Published: 1 January 1987
PDF: 7 pages
Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); doi: 10.1117/12.967549
Show Author Affiliations
Michael R. Feldman, University of California (United States)
Sadik C. Esener, University of California (United States)
Clark C. Guest, University of California (United States)
Sing H. Lee, University of California (United States)

Published in SPIE Proceedings Vol. 0836:
Optoelectronic Materials, Devices, Packaging, and Interconnects
Theodore E. Batchman; Richard Franklin Carson; Robert L. Galawa; Henry J. Wojtunik, Editor(s)

© SPIE. Terms of Use
Back to Top