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Proceedings Paper

Multiple Fiber Interconnect Using Silicon V-Grooves
Author(s): P. C. Chang; S. Sriram; A. C. Wey
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Paper Abstract

A new interconnect method for multiple fibers is reported. The design concept proposes novel silicon components to align and position multifiber subassemblies, which have V-grooves to capture either fiber ribbon or monocoated fibers. The silicon components are fabricated by using preferential crystallographic etching techniques. This approach differs from earlier efforts, as preferential etching of silicon is used not only for the fiber placement, but for array alignment as well. Preliminary results are presented to demonstrate the concept.

Paper Details

Date Published: 1 January 1987
PDF: 8 pages
Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); doi: 10.1117/12.967544
Show Author Affiliations
P. C. Chang, Amphenol Corporation (United States)
S. Sriram, Amphenol Corporation (United States)
A. C. Wey, Amphenol Corporation (United States)

Published in SPIE Proceedings Vol. 0836:
Optoelectronic Materials, Devices, Packaging, and Interconnects
Theodore E. Batchman; Richard Franklin Carson; Robert L. Galawa; Henry J. Wojtunik, Editor(s)

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