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Proceedings Paper

Application Specific Wafer Stepper
Author(s): Dick Fallon; James R. Shih
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Paper Abstract

Overlay, throughput and lens performance are three critical parameters of optical alignment equipment. High overlay accuracy will give high die yields for alignment sensitive parts or can allow designers to use tighter design rules which will allow a shrink of the chip and more chips per wafer. This work contains high overlay accuracy data obtained during the processing of production wafer lots of a 64K HRAM (Hierarchical RAM) device using an ASM Lithography PAS 2000 Wafer Stepper.

Paper Details

Date Published: 1 January 1987
PDF: 10 pages
Proc. SPIE 0772, Optical Microlithography VI, (1 January 1987); doi: 10.1117/12.967052
Show Author Affiliations
Dick Fallon, ASM Lithography, Inc. (United States)
James R. Shih, Cypress Semiconductor (United States)


Published in SPIE Proceedings Vol. 0772:
Optical Microlithography VI
Harry L. Stover, Editor(s)

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