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Proceedings Paper

Generation Of Design Rules Consistent With Lithographic Capability
Author(s): Christopher P. Ausschnitt; Shaunee Cheng; Michael Lutz
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Paper Abstract

Integrated circuit (IC) design rules are determined by: 1. Circuit performance required to meet the needs of the IC customer, 2. Production capability of the IC manufacturer. In the first case, the only constraint is device physics. In the second case, the constraints are equipment and process performance coupled with the intrinsic variability of the manufacturing cycle. We view the generation of design rules from the manufacturing perspective. In examples, we relate design rules to lithographic performance as measured in a one-micron production environment. The effects of spatial and temporal variation on critical dimension and pattern registration control are treated. We establish a method to identify the cost/benefit tradeoffs of design and manufacturing. The resultant design rules embody guidelines for the cost-effective manufacture of competitive IC products.

Paper Details

Date Published: 1 January 1987
PDF: 8 pages
Proc. SPIE 0772, Optical Microlithography VI, (1 January 1987); doi: 10.1117/12.967038
Show Author Affiliations
Christopher P. Ausschnitt, Obelisk, Inc. (United States)
Shaunee Cheng, Intel Corporation (United States)
Michael Lutz, Intel Corporation (United States)

Published in SPIE Proceedings Vol. 0772:
Optical Microlithography VI
Harry L. Stover, Editor(s)

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