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Proceedings Paper

An Automatic Visual Alignment and Inspection Station for Tape Automated Bonding (TAB) Products
Author(s): Gerald J . Gleason; Tom Pandolfi; Russell R. Ames; Michael J Chen
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Paper Abstract

In addition to reviewing the major alignment and inspection procedures in producing miniaturized electronic components, this paper describes a 3D automated vision system used in the inspection of TAB (Tape Automated Bonding) products. This multi-sensor system utilizing four solid-state cameras is aliased IBIS Intelligent Bump-tape Inspection System. Besides the capabilities to measure the major planar geometric features, the key features of this system include (1) structured-light 31) vision for etch depth measurement, (2) data-base driven inspection, (3) close coupling of microsensing and micropositioning, (4) sequential usage of multiple resolution cameras and computer controlled illumination for optimal micromeasurements, and ( 5 ) statistical analysis of measured data for process trend monitoring.

Paper Details

Date Published: 19 December 1985
PDF: 9 pages
Proc. SPIE 0557, Automatic Inspection and Measurement, (19 December 1985); doi: 10.1117/12.966257
Show Author Affiliations
Gerald J . Gleason, Machine Intelligence Corporation (United States)
Tom Pandolfi, Machine Intelligence Corporation (United States)
Russell R. Ames, Machine Intelligence Corporation (United States)
Michael J Chen, Machine Intelligence Corporation (United States)

Published in SPIE Proceedings Vol. 0557:
Automatic Inspection and Measurement
Richard A. Brook; Michael J. W. Chen, Editor(s)

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