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Proceedings Paper

Stress Sensor
Author(s): J. R. Hodor; H. J. Decker Jr.; J. Barney; J. H. Green
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Paper Abstract

New sensors have been developed that inspect the quality of transparent materials, specifically silicon solar cells. These sensors inspect for surface, as well as, subsurface cracks and induced stresses. The main reason for development of these sensors is their ability to quantize the stresses. In the area of large solar array production, which was introduced by the Solar Array Flight Experiment (SAFE) flown on the space shuttle in 1984, these sensors are under development to automate the inspection and measurement of specific solar cell array parameters during various stages of their production. The primary parameter is the electrical interconnection's bond quality to the individual solar cells. The measured stress magnitudes at these points are used to determine the quality, specifically the strength of the bond. Preliminary results have demonstrated this correlation on a limited sampling, and utilization of these sensors in production has begun. Other application areas include the manufacture (production) of solar cells (arrays) consisting of other types of materials, potentially gallium arsenide, and the manufacture of microelectronics and other semiconductor devices.

Paper Details

Date Published: 19 December 1985
PDF: 8 pages
Proc. SPIE 0557, Automatic Inspection and Measurement, (19 December 1985); doi: 10.1117/12.966253
Show Author Affiliations
J. R. Hodor, Lockheed Missiles and Space Company, Inc. (United States)
H. J. Decker Jr., Lockheed Missiles and Space Company, Inc. (United States)
J. Barney, Lockheed Missiles and Space Company, Inc. (United States)
J. H. Green, Lockheed Missiles and Space Company, Inc. (United States)

Published in SPIE Proceedings Vol. 0557:
Automatic Inspection and Measurement
Richard A. Brook; Michael J. W. Chen, Editor(s)

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