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Proceedings Paper

EUV mask inspection study for sub-20nm device
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Paper Abstract

Reflected light inspection has been used to inspect EUVL mask which consists of multi layers and metal absorber. However, sub-wavelength half pitch patterns and reflected inspection make unprecedented phenomenon like tone inversion. These lead EUV inspection more difficult in detectability and inspectability for separating out defects and false. In this study, we report the evaluation result of inspection dependency of illumination conditions like OAI(Off-Axis Illumination), sigma and polarization for sub-20nm EUVL PDM(programmed defect mask). With inspection of sub- 20nm device mask, we finally address the inspection feasibility for sub-20nm device and the future direction of inspection technology.

Paper Details

Date Published: 8 November 2012
PDF: 9 pages
Proc. SPIE 8522, Photomask Technology 2012, 85220M (8 November 2012); doi: 10.1117/12.964964
Show Author Affiliations
Inkyun Shin, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Gisung Yoon, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Ji Hoon Na, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Paul D. H. Chung, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Chan-Uk Jeon, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8522:
Photomask Technology 2012
Frank E. Abboud; Thomas B. Faure, Editor(s)

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