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Proceedings Paper

Cluster Processing For 16-Mb DRAM Production
Author(s): Albert Bergendahi; David Horak
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Paper Abstract

Multichamber and in-situ technology are used to meet the challenge of manufacturing 16-Mb cost/per-formance DRAMs. The 16-Mb fabrication process is more complex than earlier 1-Mb and 4-Mb chips. Clustering of sequential process steps effectively compensates for both manufacturing complexity and foreign-material (FM) related defect densities. The development time of clusters combining new processes and equipment in multiple automated steps is nearly as long as the product development cycle. This necessitates codevelopment of manufacturing process clusters with technology integration while addressing the factors influencing FM defect generation, processing turnaround time (TAT), manufacturing costs, yield and array cell and support device designs. The advantages of multichamber and in situ processing have resulted in their application throughout the entire 16-Mb DRAM process as appropriate equipment becomes available.

Paper Details

Date Published: 15 February 1990
PDF: 10 pages
Proc. SPIE 1188, Multichamber and In-Situ Processing of Electronic Materials, (15 February 1990); doi: 10.1117/12.963942
Show Author Affiliations
Albert Bergendahi, IBM General Technology Division (United States)
David Horak, IBM General Technology Division (United States)

Published in SPIE Proceedings Vol. 1188:
Multichamber and In-Situ Processing of Electronic Materials
Robert S. Freund, Editor(s)

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