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Proceedings Paper

Process Integration: The Future of Chipmaking
Author(s): David N. K. Wang
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Paper Abstract

As with any concept in its early stages or realization, there are many ways of thinking about what we call "process integration" in semiconductor manufacturing. In its most simple form, we consider it to be the combining of two or more sequential processing steps, normally performed in separate systems, into a unified process flow within one fabrication tool.

Paper Details

Date Published: 15 February 1990
PDF: 5 pages
Proc. SPIE 1188, Multichamber and In-Situ Processing of Electronic Materials, (15 February 1990); doi: 10.1117/12.963938
Show Author Affiliations
David N. K. Wang, Applied Materials, Inc. (United States)


Published in SPIE Proceedings Vol. 1188:
Multichamber and In-Situ Processing of Electronic Materials
Robert S. Freund, Editor(s)

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