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Proceedings Paper

Die-To-Database Inspection - An Effective Method Of Detecting And Locating Defects On Reticles
Author(s): Eileen Jozefov; Steve Follis; Wayne Ruch
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Paper Abstract

As the drive towards increased production of VLSI type devices continues, integrated circuit fabrication has become increasingly dependent on stepper technology to meet the demands for denser geometries, smaller critical dimensions, and tighter registration tolerances. This technology is based on repetitively exposing the wafers in a field-by-field manner using a reticle which is either a single or multi-die IC pattern. This technology differs from that of the 1X projection aligner in which there is a one-to-one correspondence between the mask and the imaged wafer.

Paper Details

Date Published: 20 August 1986
PDF: 9 pages
Proc. SPIE 0633, Optical Microlithography V, (20 August 1986); doi: 10.1117/12.963712
Show Author Affiliations
Eileen Jozefov, Harris Semiconductor (United States)
Steve Follis, Harris Semiconductor (United States)
Wayne Ruch, Harris Semiconductor (United States)


Published in SPIE Proceedings Vol. 0633:
Optical Microlithography V
Harry L. Stover, Editor(s)

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