Share Email Print
cover

Proceedings Paper

Focused Ion Beam System For Submicron Lithography
Author(s): R. Aihara; H. Sawaragi; H. Morimoto; T. Kato
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Focused ion beam (FIB) technology has capabilities for resist exposure, maskless implantation, and other applications for semicon-ductor devices with submicron dimensions. Focused ion beam systems, the JIBL-100 and 150, are able to obtain a finely focused ion probe with a diameter less than 0.1 micron using a liquid metal ion (LMI) sources. The JIBL-100 system has been developed for fundamental experiments of FIB technology. The JIBL-150 system is a lithography system controlled by a DEC-VAX11/730 and HP9920 computers. Using these systems, some experiments for sub-half micron lithography have been demonstrated. Both single and double charge Be and Si ion beams are obtainable from an Au-Si-Be LMI source. They can be used for resist exposure with various resist thickness and resist profiles. For example, a T-shaped resist profile was fabricated using 200 keV Be and Si ion beams.

Paper Details

Date Published: 30 June 1986
PDF: 7 pages
Proc. SPIE 0632, Electron-Beam, X-Ray, and Ion-Beam Technology for Submicrometer Lithographies V, (30 June 1986); doi: 10.1117/12.963685
Show Author Affiliations
R. Aihara, Jeol Ltd. (Japan)
H. Sawaragi, Jeol Ltd. (Japan)
H. Morimoto, Mitsubishi Electric Corp. (Japan)
T. Kato, Mitsubishi Electric Corp. (Japan)


Published in SPIE Proceedings Vol. 0632:
Electron-Beam, X-Ray, and Ion-Beam Technology for Submicrometer Lithographies V
Phillip D. Blais, Editor(s)

© SPIE. Terms of Use
Back to Top