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Proceedings Paper

To Layer Resist For Plasma Etching
Author(s): H. H. Wang; E. Lin
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Paper Abstract

A capped photoresist mask of Kodak 809 on PN with minimal undercut is developed. The advantage of leaving Kodak 809 cap is that it offers better erosion resistance in the chlorine-containing plasma. The undercut of PMMA is dependent on the incidence angle of ultraviolet light to the resist. A wide incident angle creates substantial undercut while a normal incidence produces very slight undercut.

Paper Details

Date Published: 9 July 1986
PDF: 3 pages
Proc. SPIE 0631, Advances in Resist Technology and Processing III, (9 July 1986); doi: 10.1117/12.963656
Show Author Affiliations
H. H. Wang, Hewlett Packard, SCTC (United States)
E. Lin, Hewlett Packard, SCTC (United States)


Published in SPIE Proceedings Vol. 0631:
Advances in Resist Technology and Processing III
C. Grant Willson, Editor(s)

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