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Proceedings Paper

Board Level High Speed Photonic Interconnections: Recent System Developments
Author(s): Gail R. Lalk; Penny D. Smith; David W. Emmetts; Davis H. Hartman
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Paper Abstract

The device requirements and system design issues for board-level optical links differ from their counterparts in optical links used for longer distance communications. We have fabricated a research prototype of a board-level optical link which is designed to operate in a high-speed digital equipment internal interconnect environment. The experimental transmitter and receiver packages are specifically designed for subminiaturized applications. We have explored the use of photolithographically patterned waveguides made of polymers as an alternative to the use of fiber at the board level. The major aspects of the device design are reviewed, but the emphasis of this paper is the systems-level design issues. We will discuss the design goals and the performance of the link. The results of this work demonstrate the feasibility of optics for signal distribution at the board level.

Paper Details

Date Published: 23 January 1990
PDF: 8 pages
Proc. SPIE 1178, Optical Interconnects in the Computer Environment, (23 January 1990); doi: 10.1117/12.963377
Show Author Affiliations
Gail R. Lalk, Bellcore (United States)
Penny D. Smith, Bellcore (United States)
David W. Emmetts, Bellcore (United States)
Davis H. Hartman, Bellcore (United States)


Published in SPIE Proceedings Vol. 1178:
Optical Interconnects in the Computer Environment
James Pazaris; Gerald R. Willenbring, Editor(s)

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