Share Email Print

Proceedings Paper

CCD Chemical/Mechanical Thinning Results
Author(s): M. P. Lesser
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Charge-coupled devices (CCDs) are becoming increasingly used as the primary detector for many astronomical imaging and spectroscopic instruments. The major limitations of front-illuminated CCDs in this field are their lack of blue and UV spectral response and relatively poor visible light response. Thinned, back-illuminated CCDs can achieve significantly higher quantum efficiency but typically have a warped imaging surface, non-uniform flat-field response, and often do not respond well to backside charging techniques to eliminate the backside potential well. We describe here a novel thinning/polishing technique which produces an optically fiat imaging surface independent of the epitaxial/substrate interface location. Chemical/mechanical polishing can be used to thin a CCD when the final device thickness is greater 20pm or possible a wafer to any thickness. We discuss the effect of silicon thickness and thinning technique on surface warpage. We also discuss the bump bonding mounting method which we are beginning to use to improve the yield of the thinning process, the ease of backside charging and antireflection coating, and the ability to produce mosaics of CCDs for large focal planes such as the new generation of ground-based telescopes.

Paper Details

Date Published: 22 December 1989
PDF: 8 pages
Proc. SPIE 1161, New Methods in Microscopy and Low Light Imaging, (22 December 1989); doi: 10.1117/12.962692
Show Author Affiliations
M. P. Lesser, University of Arizona (United States)

Published in SPIE Proceedings Vol. 1161:
New Methods in Microscopy and Low Light Imaging
John E. Wampler, Editor(s)

© SPIE. Terms of Use
Back to Top