Proceedings PaperLocalization Of Failures In Electronic Devices With A Laser Scan Microscope Using A Golden Device Test
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Two methods are described allowing the localization of defects (e.g. hot spots, leakage currents, electrostatic discharge defects) in electric devices using the OBIC (optical beam induced current) signal produced by a laser scan microscope. Knowledges about the generation of the OBIC and the design of the integrated circuit are not needed. In both methods the OBIC signals of a device under test and a good reference device (golden device) are compared. The difference between the two OBIC - images reveals any dissimilarities and in this way localizes defects in a device under test.