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Proceedings Paper

An Automated System For Submicrometer Defect Detection On Patterned Wafers
Author(s): Michel Darboux; Anne Falut; Jean-Luc Jacquot; Claude Doche
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Paper Abstract

Nowadays process control has become essential for yield management in VLSI manufacturing so there is a growing need for automated in-process wafer inspection systems. In this paper we describe a fast automated system for submicrometer defect detection on patterned wafers, based on an improved image comparison algorithm. After a brief discussion of the different inspection modes and their applications, we introduce our image processing algorithm, including : subpixel spatial alignment, interimage dynamic range adaptation, multi-threshold efficient binarization, defect identification based on a specific morphological method. This algorithm provide both a significant improvement of true defect detection and a reduction of the false defect rate. Then we describe the main components of the inspection machine : the optical parts, the mechanical parts and a Fast Image Processing Unit (FIPU) based on a pipeline architecture including special purpose hardware. The FIPU allows the inspection of a 125 µm x 125 μm field in 200 ms with a defect sensitivity of 0.3 μm. Finally we report a few experimental results obtained by applying our algorithm on some real inspection problems and we compare these results with those obtained by standard inspection algorithm.

Paper Details

Date Published: 11 October 1989
PDF: 6 pages
Proc. SPIE 1138, Optical Microlithography and Metrology for Microcircuit Fabrication, (11 October 1989); doi: 10.1117/12.961759
Show Author Affiliations
Michel Darboux, Centre d'Etudes Nucleaires de Grenoble (France)
Anne Falut, Centre d'Etudes Nucleaires de Grenoble (France)
Jean-Luc Jacquot, Centre d'Etudes Nucleaires de Grenoble (France)
Claude Doche, Centre d'Etudes Nucleaires de Grenoble (France)


Published in SPIE Proceedings Vol. 1138:
Optical Microlithography and Metrology for Microcircuit Fabrication

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