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Proceedings Paper

Temperature Uniformity Measurement Techniques For Rapid Thermal Processing
Author(s): Carl Russo
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Paper Abstract

Temperature and temperature uniformity measurements in rapid thermal processing (RTP) require accurate, non-contact methods which operate over the temperature range of approximately 300-1400°C with accuracies and reproducibilities of better than 5°C. Non-contact methods for temperature measurements include [optical and infrared pyrometry] comparison measurements made by thermocouples inserted into dummy samples, and methods for temperature uniformity measurement include multiple sensor measurements over the wafer and a variety of process tests which include oxide growth, silicide sintering, polysilicon annealing, partial activation recrystallization and localized melting. Once the temperature measurement has been successfully completed, the results can be used for temperature control. Temperature control techniques include a mixture of optimal nonlinear, PID, and computer control.

Paper Details

Date Published: 26 June 1986
PDF: 11 pages
Proc. SPIE 0623, Advanced Processing and Characterization of Semiconductors III, (26 June 1986); doi: 10.1117/12.961202
Show Author Affiliations
Carl Russo, Varian Associates Extrion Division (United States)

Published in SPIE Proceedings Vol. 0623:
Advanced Processing and Characterization of Semiconductors III
Devindra K. Sadana; Michael I. Current, Editor(s)

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