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Proceedings Paper

Future Capabilities Of Z-Plane Technology
Author(s): Myles F. Suer; John C. Carson
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Paper Abstract

Z-plane electronics packaging technology was initially developed to provide real estate for advanced analog signal processing infrared circuitry for focal plane applications. This paper will discuss the relevant qualities of Z-technology, review forecasting technology methodologies, and develop conclusions regarding the future of 3-dimensional electronics--both analog and digital.

Paper Details

Date Published: 13 September 1989
PDF: 9 pages
Proc. SPIE 1097, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array, (13 September 1989); doi: 10.1117/12.960368
Show Author Affiliations
Myles F. Suer, Irvine Sensors Corporation (United States)
John C. Carson, Irvine Sensors Corporation (United States)


Published in SPIE Proceedings Vol. 1097:
Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array
John C. Carson, Editor(s)

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