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Proceedings Paper

Photochemically Machined, Glass Ceramic, Optical Fiber Interconnection Components
Author(s): Joel L. Plawsky; Gregory E. Williams; Paul A. Sachenik
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Paper Abstract

An optical fiber array interconnection substrate for computer applications was dgveloped based around a photomachinable glass-ceramic material having the trade name Fotofore% Devices incorporating up to 32 fibers on a single chip were shown to be possible, and the material was demonstrated to be patternable with accuracies approaching single crystal silicon. The glass-ceramic material has several advantages over silicon in that it is less brittle, can be easily loaded with fibers, and can be assembled using UV curable epoxies.

Paper Details

Date Published: 9 February 1989
PDF: 7 pages
Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); doi: 10.1117/12.960116
Show Author Affiliations
Joel L. Plawsky, Corning Glass Works (United States)
Gregory E. Williams, Corning Glass Works (United States)
Paul A. Sachenik, Corning Glass Works (United States)


Published in SPIE Proceedings Vol. 0994:
Optoelectronic Materials, Devices, Packaging, and Interconnects II
Glen M. McWright; Henry J. Wojtunik, Editor(s)

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