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Proceedings Paper

Board Level High Speed Photonic Interconnections: Recent Technology Developments
Author(s): David H. Hartman; Gail R. Lalk; Thomas C. Banwell; Ivan Ladany
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Paper Abstract

Board level photonic interconnections offer the potential of enhancing standard high speed electronic systems performance. But, to be successful, significant advances in optoelectronics packaging, physical design and subminiaturization are necessary. This paper addresses these physical design issues. Solutions currently being researched are presented. Technology advances in transmitter, receiver, and optical channel development are reported.

Paper Details

Date Published: 9 February 1989
PDF: 8 pages
Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); doi: 10.1117/12.960110
Show Author Affiliations
David H. Hartman, Bell Communications Research (United States)
Gail R. Lalk, Bell Communications Research (United States)
Thomas C. Banwell, Bell Communications Research (United States)
Ivan Ladany, Consultant (United States)

Published in SPIE Proceedings Vol. 0994:
Optoelectronic Materials, Devices, Packaging, and Interconnects II
Glen M. McWright; Henry J. Wojtunik, Editor(s)

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