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Proceedings Paper

Vertical Fiber Coupling For High-Density Optical Interconnection
Author(s): R. W. Ade; E. R. Fossum; M. A. Tischler
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Paper Abstract

A GaAs/AIGaAs fiber-optic interconnect structure for high-density applications is discussed. The vertical approach, which employs reactive-ion-etched cavities to couple fibers to the semiconductor substrate, permits interconnect arrays with densities up to 1600 sites/cm2. Factors affecting the applicability of the fiber coupler and the achievable packing density are considered.

Paper Details

Date Published: 9 February 1989
PDF: 7 pages
Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); doi: 10.1117/12.960107
Show Author Affiliations
R. W. Ade, Columbia University (United States)
E. R. Fossum, Columbia University (United States)
M. A. Tischler, IBM Thomas J. Watson Research Center (United States)

Published in SPIE Proceedings Vol. 0994:
Optoelectronic Materials, Devices, Packaging, and Interconnects II
Glen M. McWright; Henry J. Wojtunik, Editor(s)

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