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Proceedings Paper

High Performance Hermetic Package For LiNbO[sub]3[/sub] Electro-Optic Waveguide Devices
Author(s): K. R. Preston; B. M. Macdonald; R. A. Harmon; C. W. Ford; R. N. Shaw; I. Reid; J. H. Davidson; A. R. Beaumont; R. C. Booth
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Paper Abstract

A high performance fibre-tailed package for LiNbO3 electro-optic waveguide devices is described. The package is based around a hermetic metal submodule which contains no epoxy or other organic materials. The LiNbO3 chip is mounted using a soldering technique, and laser welding is used for fibre fixing to give stable, low loss optical coupling to single mode fibres. Optical reflections are minimised by the use of antireflective coatings on the fibre ends and waveguide facets. High speed electrical connections are made via coplanar glass-sealed leadthroughs to LiNb03 travelling wave devices, and packaged device operation to frequencies in excess of 4GHz is demonstrated.

Paper Details

Date Published: 9 February 1989
PDF: 8 pages
Proc. SPIE 0994, Optoelectronic Materials, Devices, Packaging, and Interconnects II, (9 February 1989); doi: 10.1117/12.960106
Show Author Affiliations
K. R. Preston, British Telecom Research Laboratories (United Kingdom)
B. M. Macdonald, British Telecom Research Laboratories (United Kingdom)
R. A. Harmon, British Telecom Research Laboratories (United Kingdom)
C. W. Ford, British Telecom Research Laboratories (United Kingdom)
R. N. Shaw, British Telecom Research Laboratories (United Kingdom)
I. Reid, British Telecom Research Laboratories (United Kingdom)
J. H. Davidson, British Telecom Research Laboratories (United Kingdom)
A. R. Beaumont, British Telecom Research Laboratories (United Kingdom)
R. C. Booth, British Telecom Research Laboratories (United Kingdom)


Published in SPIE Proceedings Vol. 0994:
Optoelectronic Materials, Devices, Packaging, and Interconnects II
Glen M. McWright; Henry J. Wojtunik, Editor(s)

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