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Proceedings Paper

Non-Destructive Testing Of Reflow On Si Wafer
Author(s): B. Laloux; J. F. Teissier; A. Tissier
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Paper Abstract

One of the very critical steps in the manufacturing process of VLSI (Very Large Scale Integrated) circuits is the reflow of PSG and BPSG (Phosphosilicate Glasses and Borophosphosilicate Glasses). The ref/ow consists in increasing the temperature during a given time to obtain a viscous deformation of these silica based glasses. So far, the only way to measure the effective result of the reflow on the layer was a destructive test. In this paper, we present a new system which uses an original non-destructive measurement of the degree of reflow. The principle of this method is to monitor the diffraction pattern evolution of one or several corrugated gratings located on the wafe

Paper Details

Date Published: 19 January 1989
PDF: 6 pages
Proc. SPIE 0990, Chemical, Biochemical, and Environmental Applications of Fibers, (19 January 1989); doi: 10.1117/12.959988
Show Author Affiliations
B. Laloux, Photonetics SA (France)
J. F. Teissier, Photonetics SA (France)
A. Tissier, CNET/CNS (France)


Published in SPIE Proceedings Vol. 0990:
Chemical, Biochemical, and Environmental Applications of Fibers
Robert A. Lieberman; Marek T. Wlodarczyk, Editor(s)

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