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Proceedings Paper

Laser Scanner For Automatic Inspection Of Printed Wiring Boards
Author(s): Philip Geise; Eugene George; Fritz Freese; Robert Brown; Victor Ruwe
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Paper Abstract

An, Instrument is described which inspects unpopulated, populated (components onserted and leads clinched), and soldered printed wiring boards for correct hole location, component presence, correct lead clinch direction and solder bridges. The instrument consists of a low power heliumneon laser, an x-y moving iron galvanometer scanner and several folding mirros. A unique shadow signature is detected by silicon photodiodes located at the optium geometry to allow rapid and reliable detection of components with correctly clinched leads. A reflective glint screen is utilized to inspect for a solder bridges. The detected signal are processed and evaluated by a minocomputer which also controls the scan inspection rate of at least 25 components or 50 components holes per second. The return of investment on this instrument for high volume production of printed wirind boards is less than one yea and only slightly longer for medium run military application.

Paper Details

Date Published: 19 November 1980
PDF: 8 pages
Proc. SPIE 0255, Practical Electro-Optical Instruments and Techniques, (19 November 1980); doi: 10.1117/12.959558
Show Author Affiliations
Philip Geise, Chrysler Corporation (United States)
Eugene George, Chrysler Corporation (United States)
Fritz Freese, Chrysler Corporation (United States)
Robert Brown, U.S. Army Missile Command (United States)
Victor Ruwe, U.S. Army Missile Command (United States)

Published in SPIE Proceedings Vol. 0255:
Practical Electro-Optical Instruments and Techniques
Robert L. Kurtz, Editor(s)

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