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Proceedings Paper

Laminated Mosaic Module Performance Measurements
Author(s): Gary L. Payton; Larry G. Pfaffly; William R. Reitman
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Paper Abstract

Laminated mosaic modules, a z-technology are introduced as an alternative architectural configuration for mosaic sensor focal plane applications. The module features a 4096 element (8x512) PbS array with 64 thirty-two input signal processing chips. Modules can be stacked into subarrays without a composite array fill factor loss. Measurements and results confirm the performance status of this technology development approach. Module components are discussed first followed by the module assembly and the subarray (a four module stack).

Paper Details

Date Published: 17 December 1980
PDF: 10 pages
Proc. SPIE 0253, Modern Utilization of Infrared Technology VI, (17 December 1980); doi: 10.1117/12.959500
Show Author Affiliations
Gary L. Payton, Grumman Aerospace Corporation (United States)
Larry G. Pfaffly, Grumman Aerospace Corporation (United States)
William R. Reitman, Grumman Aerospace Corporation (United States)


Published in SPIE Proceedings Vol. 0253:
Modern Utilization of Infrared Technology VI
Irving J. Spiro, Editor(s)

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