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Proceedings Paper

Modular High Density Large Focal Plane Concepts
Author(s): H. J. Strasler
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Paper Abstract

Staring sensor systems require large fields-of-view with fine resolution. This combination requires systems which contain several million detector elements, or pixels, on the focal plane. A modular approach for this focal plane assembly has been deve,loo,:Ld at Rockwell International. The assembly is romnrised of detector chips mounted on carriers which in turn are placed ',TILL, sqbmodules. The submcduLe: ara modules and the modules into a focal plane. It is desirable to have a very low, inactive, or dead, area in the total focal plane array. The assembly must address at least three interfaces: mechanical, electrical, and thermal. The mechanical tolerances in obtaining the appropriate focal surface are very critical. The focal surface must be maintained at a low temperature with a very small variation during operation. Low dead space demands multiple lead fan-in and many signals being transmitted simultaneously thus the electrical interface is quite critical. This paper will describe a prototype assembly which was developed to evaluate the major assembly and interface areas. Tooling and assembly fixtures were built as required. Assembly tolerance measurements made and checked after thermal cycling and launch environment vibrations and shock will be presented.

Paper Details

Date Published: 18 February 1981
PDF: 7 pages
Proc. SPIE 0244, Mosaic Focal Plane Methodologies I, (18 February 1981); doi: 10.1117/12.959307
Show Author Affiliations
H. J. Strasler, Rockwell International Corporation (United States)


Published in SPIE Proceedings Vol. 0244:
Mosaic Focal Plane Methodologies I
William S. Chan, Editor(s)

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