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Proceedings Paper

Hybrid Extrinsic Silicon Focal Plane Architecture
Author(s): D. H. Pommerrenig; T. Meinhardt; J. Lowe
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Paper Abstract

Large-area focal planes require mechanical assembly techniques which must be compatible with optical alignment, minimum deadspace, and cryogenic requirements in order to achieve optimum performance. Hybrid extrinsic silicon has been found particularly suitable for such an application. It will be shown that by choosing a large-area extrinsic silicon detector array which is hybrid-mated to a multiplicity of multiplexers a very cost-effective and high-density focal plane module can be assembled. Other advantages of this approach are inherent optical alignment and excellent performance.

Paper Details

Date Published: 18 February 1981
PDF: 4 pages
Proc. SPIE 0244, Mosaic Focal Plane Methodologies I, (18 February 1981); doi: 10.1117/12.959300
Show Author Affiliations
D. H. Pommerrenig, Rockwell International (United States)
T. Meinhardt, Rockwell International (United States)
J. Lowe, Rockwell International (United States)


Published in SPIE Proceedings Vol. 0244:
Mosaic Focal Plane Methodologies I
William S. Chan, Editor(s)

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