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Proceedings Paper

Multiplexed Intrinsic Detector Arrays With Signal Processing (MIDASP) Program Development Of Hybrid Technology For Advanced Scanning Systems
Author(s): M. Gurnee; R. Rawe; M. Dries
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Paper Abstract

The MIDASP program has been aimed at development of the fundamental technology necessary for fabrication of hybrid (Hg,Cd)Te detector/silicon signal processor focal planes for second generation FL 1R systems. Effort has been concentrated in four areas: 1) 3-5 micrometer (Hg,Cd)Te photodiodes, 2) detector/CCD mechanical inter-connect, 3) detector/CCD electrical coupling, and 4) fabrication and evaluation of small focal plane structures. Detector/CCDs with several 8-TD1 channels multiplexed to a single output have been successfully demonstrated, with an overall D* of up to 1x1014 cm-Hz1/2/W.

Paper Details

Date Published: 6 August 1980
PDF: 8 pages
Proc. SPIE 0225, Infrared Image Sensor Technology, (6 August 1980); doi: 10.1117/12.958699
Show Author Affiliations
M. Gurnee, Honeywell Electro-Optics Center (United States)
R. Rawe, Honeywell Electro-Optics Center (United States)
M. Dries, Honeywell Solid State Electronics Center (United States)


Published in SPIE Proceedings Vol. 0225:
Infrared Image Sensor Technology
Esther Krikorian, Editor(s)

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