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Proceedings Paper

Hybrid Focal-Plane Array Development
Author(s): David H. Alexander
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Paper Abstract

Hybrid focal plane arrays for infrared detection have progressed rapidly over the past seven years from the point of proof of feasibility to demonstration of imagery. Hybrid arrays generally use two different semiconductor materials; an infrared detection material such as HgCdTe or InSb, and a silicon substrate chip which performs initial signal processing on the detector signal. Hybrid arrays have also been fabricated using extrinsic silicon detectors on a silicon substrate (SOX). A third important element in hybrid arrays is the interconnect technology used to electrically connect the detectors with the silicon substrate chip. Mechanical and thermal interaction of the two materials must be considered as well as the electrical. Hybrid arrays fabricated with InSb and HgCdTe detectors have demonstrated nearly BLIP operation. This paper will discuss some hybrid chips that have been developed and future trends in hybrid arrays.

Paper Details

Date Published: 6 August 1980
PDF: 8 pages
Proc. SPIE 0225, Infrared Image Sensor Technology, (6 August 1980); doi: 10.1117/12.958696
Show Author Affiliations
David H. Alexander, Hughes Aircraft Company (United States)

Published in SPIE Proceedings Vol. 0225:
Infrared Image Sensor Technology
Esther Krikorian, Editor(s)

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