Share Email Print
cover

Proceedings Paper

Registration And Wafer Distortion In The Production Environment
Author(s): J. Hester; C. Vesper; R . Cody; J E. Martin
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Production of MOS/LSI circuits with minimum design rule dimensions of 4-6 microns without complete self-aligning features has provided the opportunity to study several aspects of mask to wafer registration. The mask working tools and wafers can be major contributors to misregistration. Detailed measurements and analysis are presented to illuminate the contribution of mask substrate material and wafer physical characteristics (surface, texture, thickness, crystal type, crystal defects) to misregistration. Conclusions are drawn with regard to the practical solution to misregistration in the production environment. Low expansion substrates for masks and thick (20 mil) wafers provide adequate dimensional control for registration.

Paper Details

Date Published: 5 September 1980
PDF: 8 pages
Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980); doi: 10.1117/12.958629
Show Author Affiliations
J. Hester, Rockwell International (United States)
C. Vesper, Rockwell International (United States)
R . Cody, Rockwell International (United States)
J E. Martin, Rockwell International (United States)


Published in SPIE Proceedings Vol. 0221:
Developments in Semiconductor Microlithography V
James W. Dey, Editor(s)

© SPIE. Terms of Use
Back to Top