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Proceedings Paper

Evaluation Of Deep-UV Proximity Mode Printing
Author(s): D. O. Massetti; M. A. Hockey; D. L. McFarland
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Paper Abstract

Proximity mode printing technology has the potential to achieve adequate defect levels for economical fabrication of VLSI devices. The application of deep-UV to proximity mode printing is evaluated in order to extend achievable resolution to greater wafer-to-mask separations. This technique promises to be a viable supplemental technology to wafer stepper technology.

Paper Details

Date Published: 5 September 1980
PDF: 7 pages
Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980); doi: 10.1117/12.958621
Show Author Affiliations
D. O. Massetti, NCR Microelectronics (United States)
M. A. Hockey, NCR Microelectronics (United States)
D. L. McFarland, NCR Microelectronics (United States)


Published in SPIE Proceedings Vol. 0221:
Developments in Semiconductor Microlithography V
James W. Dey, Editor(s)

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