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Proceedings Paper

Intermachine Registration Errors of Wafer Step-and-Repeat Systems
Author(s): William C. Schneider
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Paper Abstract

This paper discusses the sources of intermachine registration errors of wafer step-and-repeat systems. The vernier overlay techniques used by GCA/Burlington to measure intermachine registration of the Mann Type 4800 DSWTM Wafer StepperTM are fully described. Results are given for a number of intermachine comparisons. The use of similar vernier overlay methods to determine the intermachine registration errors between step-and-repeat systems and full field projection mask aligners is also discussed.

Paper Details

Date Published: 5 September 1980
PDF: 6 pages
Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980); doi: 10.1117/12.958620
Show Author Affiliations
William C. Schneider, GCA Burlington Division (United States)

Published in SPIE Proceedings Vol. 0221:
Developments in Semiconductor Microlithography V
James W. Dey, Editor(s)

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