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Proceedings Paper

Infrared Testing Of Printed Circuit Boards And Hybrids
Author(s): M. P. Wirick; H. A. Diede
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Paper Abstract

A system was developed as part of a MICOM Manufacturing Methods and Technology (MM&T) contract to demonstrate the applicability of thermal scanning to testing electronic circuit boards and hybrid circuits on the production line. This paper presents a description of the test equipment outlining its hardware, software, test methodology, applications, capabilities, and limitations, and gives a summary of test results. A short discussion of the probable future of thermal scanning as an electronics test method for printed circuit boards and hybrids is also included.

Paper Details

Date Published: 28 May 1980
PDF: 6 pages
Proc. SPIE 0220, Optics in Metrology and Quality Assurance, (28 May 1980); doi: 10.1117/12.958589
Show Author Affiliations
M. P. Wirick, Hughes Aircraft Company (United States)
H. A. Diede, Hughes Aircraft Company (United States)

Published in SPIE Proceedings Vol. 0220:
Optics in Metrology and Quality Assurance
Harvey L. Kasdan, Editor(s)

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