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Proceedings Paper

Large Time Delay And Integration (TDI) Focal Plane Assembly With An Optically Contiguous Pixel Format
Author(s): Henry Sadowski; William Dugger
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Paper Abstract

A 6144 X 64 pixel focal plane assembly has been constructed incorporating six 1024 X 64 Time Delay and Integration Charge-Coupled Devices (TDI CCDs) in a beam-sharer configuration. The beam-sharer approaches 100 percent efficiency over the format, compared to a maximum 50 percent efficiency for a conventional beam-splitter configuration. The TDI CCDs have 20 X 20 micrometer pixels. The focal plane assembly is constructed so that the pixels are contiguous at the optical "butt" between chips to within 2 micrometers and straight within a 6 micrometer error band over the entire six chip length. These dimensional accuracies were achieved using a precision alignment apparatus developed for this purpose. In a way similar to a comparator microscope, its optical system provides simultaneous overlapping fields of view; one incorporates fixed reference lines while the other contains a view of the CCD chips. A mechanical micro-manipulator is used to provide precise control of chip motion in three degrees of freedom (x, y, 0) for each of the two CCD mounting planes. The modular focal plane assembly technique makes practical the fabrication of large-format, gapless configurations of high optical efficiency. Both the assembly technique and methodology of subsequent repair (replacement of chips after some period of service, should that ever be required) are described in detail.

Paper Details

Date Published: 7 May 1980
PDF: 7 pages
Proc. SPIE 0217, Advances in Focal Plane Technology, (7 May 1980); doi: 10.1117/12.958483
Show Author Affiliations
Henry Sadowski, Fairchild Camera and Instrument Corporation (United States)
William Dugger, Fairchild Camera and Instrument Corporation (United States)


Published in SPIE Proceedings Vol. 0217:
Advances in Focal Plane Technology
William S. Chan, Editor(s)

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