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Proceedings Paper

Advanced Approaches To Focal Plane Integration
Author(s): Richard D. Nelson; Elroy C. Smith
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Paper Abstract

Both visible and infrared focal plane assemblies have common architectural driving parameters which guide their design approaches. The key drivers for advanced focal plane assemblies (FPA) are: the detector type and performance required; the number of detector chips; the packaging density; and the geometry. The impact of these drivers is seen to determine the engineering compromises necessary to establish FPA design approach. Several new designs are discussed which show a range of applications from single detector assemblies to monolithic detector chips with on-chip signal processing. The main objective of many advanced designs is to integrate the focal plane components in order to reduce power and re-duce the number of interconnections. The next stage of integration may come with VLSI device developments.

Paper Details

Date Published: 7 May 1980
PDF: 9 pages
Proc. SPIE 0217, Advances in Focal Plane Technology, (7 May 1980); doi: 10.1117/12.958479
Show Author Affiliations
Richard D. Nelson, Rockwell International Corporation (United States)
Elroy C. Smith, Rockwell International Corporation (United States)


Published in SPIE Proceedings Vol. 0217:
Advances in Focal Plane Technology
William S. Chan, Editor(s)

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