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Proceedings Paper

Infrared/Charge-Coupled Device (IR/CCD) Focal Planes: Principles And Practice
Author(s): R. Broudy; J. Gelpey; M. Gurnee; M. Reine; N. Foss; C. Carrison; M. Dries; T. Hendrickson
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Paper Abstract

It is now widely accepted that the next generation of infrared focal planes will be two-dimensional mosaics of infrared sensing detectors interfaced with charge transfer cells. One form in which these devices is presently being implemented is with hybrid structures using silicon CCDs for charge transfer, and infrared detectors for photon sensing, both being optimized for the desired application. The basic design of the IR/CCD is controlled by the interface requirements, both mechanical and electrical, wherein the response to photon flux is transferred, physically and electrically, from the detector through the input network to end up as charge in a CCD well. The charge is then laterally transferred off the focal plane in multiplex form. Proper design results in negligible loss in signal-to-noise ratio compared to discrete devices. This paper discusses the architecture and the design of the hybrid IR/CCD from the interface point of view, including planar and bump mechanical configurations, and electrical coupling networks. A summary of state of the art will be presented for detectors, CCDs, and IR/CCD focal planes.

Paper Details

Date Published: 7 May 1980
PDF: 14 pages
Proc. SPIE 0217, Advances in Focal Plane Technology, (7 May 1980); doi: 10.1117/12.958478
Show Author Affiliations
R. Broudy, Honeywell Electro-Optics Center (United States)
J. Gelpey, Honeywell Electro-Optics Center (United States)
M. Gurnee, Honeywell Electro-Optics Center (United States)
M. Reine, Honeywell Electro-Optics Center (United States)
N. Foss, Honeywell Systems and Research Center (United States)
C. Carrison, Honeywell Systems and Research Center (United States)
M. Dries, Honeywell Solid State Electronics Center (United States)
T. Hendrickson, Honeywell Solid State Electronics Center (United States)

Published in SPIE Proceedings Vol. 0217:
Advances in Focal Plane Technology
William S. Chan, Editor(s)

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