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Proceedings Paper

Microvibration Measurement Using Laser Beams
Author(s): Y. Fujimori; T. Komatsu; N. Hoshina
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Paper Abstract

A microvibration measuring apparatus for an ultrasonic welding tool was newly designed. This apparatus enabled non-contact, highly sensitive measurement free from floor vibration. It consists of a low power He-Ne laser, converging optics and a detector followed by electronic circuits. Even when horizontal floor vibration amplitude was as much as 20 μm, the minimum detectable amplitude of the apparatus was below 0.1 μm. By free vibration measurements, a 200 cps difference was found between maximum amplitude frequency and an electro-mechanical matching frequency. An amplitude output difference was found even in the same kind of welders. By vibration measurements during welding, it was found that vibration amplitude stability became worse.

Paper Details

Date Published: 27 July 1979
PDF: 4 pages
Proc. SPIE 0189, 13th Intl Congress on High Speed Photography and Photonics, (27 July 1979); doi: 10.1117/12.957567
Show Author Affiliations
Y. Fujimori, Toshiba Co. (Japan)
T. Komatsu, Toshiba Co. (Japan)
N. Hoshina, Toshiba Co. (Japan)


Published in SPIE Proceedings Vol. 0189:
13th Intl Congress on High Speed Photography and Photonics
Shin-Ichi Hyodo, Editor(s)

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