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Proceedings Paper

High-Resolution Computer-Controlled Television System For Hybrid Circuit Inspection
Author(s): L. Arlan; M. J. Cantella; T. J. Dudziak; M. F. Krayewsky
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Paper Abstract

We have shown that an electro-optical system can be used for 100% inspection of thick film hybrid circuits. This work was supported by the U.S. Army Electronics R&D Command under Contract No. DAAB07-77-C-0585 entitled "Automatic In-Process Microcircuit Evaluation." A high resolution (10,000 TVL/H) Return Beam Vidicon (RBV) is used to image an entire 2-inch by 2-inch substrate. The RBV is operated with computer controlled electronic steering and zoom to provide an appropriate level of detail for rapid sequential frame inspection. Video from each frame is compared with that from a referenced image stored on a video disc. Differences are displayed on a color TV monitor and processed by the computer to identify and characterize faults. Various manual and automatic inspection sequences can be programmed readily. This technique can inspect hybrid substrates at rates of 750 per hour, and its efficiency makes 100% inspection economical. This paper describes the hardware instrumentation and computer algorithms, and reports functional inspection results achieved using sample hybrid circuits with built-in flaws.

Paper Details

Date Published: 10 October 1979
PDF: 10 pages
Proc. SPIE 0182, Imaging Applications for Automated Industrial Inspection and Assembly, (10 October 1979); doi: 10.1117/12.957380
Show Author Affiliations
L. Arlan, Automated Systems (United States)
M. J. Cantella, Automated Systems (United States)
T. J. Dudziak, Automated Systems (United States)
M. F. Krayewsky, Automated Systems (United States)


Published in SPIE Proceedings Vol. 0182:
Imaging Applications for Automated Industrial Inspection and Assembly
Richard P. Kruger, Editor(s)

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