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Proceedings Paper

Automatic Mask Pattern Inspection For Printed Circuits Based On Pattern Width Measurement
Author(s): Masato Nakashima; Katsumi Fujihara; Takefumi Inagaki
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Paper Abstract

This is a new mask Inspection technique based on pattern width measurement that can check the fatality of defects. Mask quality depends on pattern width and defects in a fatal area where a normal pattern is seriously damage. In this technique, pattern width measurement and fatal defect detection with a laser beam are used for inspection of masks of PC boards. In order to determine the direction of measurement, diffracted laser light at the pattern edge and spatially divided photodetectors are used. The new inspection system (l) measures pattern width, (2)does not require the original data for comparison, (3)detects fatal defects, (4)has no special alignment and (5)detects defects as small as 10μm can be isolated with 100% accuracy.

Paper Details

Date Published: 10 October 1979
PDF: 11 pages
Proc. SPIE 0182, Imaging Applications for Automated Industrial Inspection and Assembly, (10 October 1979); doi: 10.1117/12.957370
Show Author Affiliations
Masato Nakashima, Fujitsu Laboratories Ltd. (Japan)
Katsumi Fujihara, Fujitsu Laboratories Ltd. (Japan)
Takefumi Inagaki, Fujitsu Laboratories Ltd. (Japan)


Published in SPIE Proceedings Vol. 0182:
Imaging Applications for Automated Industrial Inspection and Assembly
Richard P. Kruger, Editor(s)

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