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Proceedings Paper

New Generation Of 1:1 Optical Projection Mask Aligners
Author(s): Michael C. King; Edward S. Muraski
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Paper Abstract

The increased density of today's VLSI circuits requires a tighter control at all semi-conductor processing parameters. Included is the need for improved lithography. This paper describes a new 1:1 projection mask aligner that uses ring-field reflective optics. Described are the improvements made in the optical design and fabrication, temperature control, vibration and alignment systems all of which are required to achieve a 2-micrometer production performance. The results of the improvements are presented in terms of lithography on resist-coated silicon wafers.

Paper Details

Date Published: 17 July 1979
PDF: 5 pages
Proc. SPIE 0174, Developments in Semiconductor Microlithography IV, (17 July 1979); doi: 10.1117/12.957180
Show Author Affiliations
Michael C. King, Perkin-Elmer ICorporaton (United States)
Edward S. Muraski, Perkin-Elmer Corporaton (United States)


Published in SPIE Proceedings Vol. 0174:
Developments in Semiconductor Microlithography IV
James W. Dey, Editor(s)

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