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Proceedings Paper

Functional Laser Trimming Of Thin Film Resistors On Silicon ICs
Author(s): Michael J. Mueller; Wes Mickanin
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Paper Abstract

Modern Laser Wafer Trimming (LWT) technology achieves exceptional analog circuit performance and precision while maintain-ing the advantages of high production throughput and yield. Microprocessor-driven instrumentation has both emphasized the role of data conversion circuits and demanded sophisticated signal conditioning functions. Advanced analog semiconductor circuits with bandwidths over 1 GHz, and high precision, trimmable, thin-film resistors meet many of todays emerging circuit requirements. Critical to meeting these requirements are optimum choices of laser characteristics, proper materials, trimming process control, accurate modeling of trimmed resistor performance, and appropriate circuit design. Once limited exclusively to hand-crafted, custom integrated circuits, designs are now available in semi-custom circuit configurations. These are similar to those provided for digital designs and supported by computer-aided design (CAD) tools. Integrated with fully automated measurement and trimming systems, these quality circuits can now be produced in quantity to meet the requirements of communications, instrumentation, and signal processing markets.

Paper Details

Date Published: 7 July 1986
PDF: 16 pages
Proc. SPIE 0611, Laser Processing of Semiconductors & Hybrids, (7 July 1986); doi: 10.1117/12.956413
Show Author Affiliations
Michael J. Mueller, Tektronix, Inc. (United States)
Wes Mickanin, TriQuint Semiconductor Group 600 (United States)

Published in SPIE Proceedings Vol. 0611:
Laser Processing of Semiconductors & Hybrids
Edward J. Swenson, Editor(s)

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