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Proceedings Paper

The Infrared Microimager And Integrated Circuits
Author(s): Richard F . Leftwich; Cal A. Lidback
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Paper Abstract

An infrared MicroImager was originally introduced at SPIE in 1972. The operation of the instrument is reviewed. The application of the MicroImager in integrated circuits thermal analysis is discussed. Quantitative data relative to actual surface temperature of integrated circuits is available from infrared observations. Thermal signatures of integrated circuits obtained from MicroImager observations provide valuable information to circuit designers, process engineers and failure analysts. Thermal signatures support theoretical conclusions regarding thermal distrihutio by presenting empirical observations.

Paper Details

Date Published: 26 August 1977
PDF: 7 pages
Proc. SPIE 0104, Multidisciplinary Microscopy, (26 August 1977); doi: 10.1117/12.955426
Show Author Affiliations
Richard F . Leftwich, Barnes Engineering Company (United States)
Cal A. Lidback, Motorola Integrated Circuits (United States)

Published in SPIE Proceedings Vol. 0104:
Multidisciplinary Microscopy
Robert Whitman, Editor(s)

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