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Proceedings Paper

Projection Printing Characterization
Author(s): John W. Bossung
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Paper Abstract

Projection printing eliminates the problems introduced by hard-contacting the mask to the wafer while maintaining the high resolution requirements of the integrated circuit manufacturer. Certain advantages of projection printing are obvious: the wafers are not contaminated or damaged by contact with the mask, and the mask will not wear out. Less obvious are the steps required to maximize the advantages of projection printing, thereby reducing costs and increasing yields. This paper considers photoresist choices, suggests some procedures to determine process variables, and discusses mask costs and quality effects.

Paper Details

Date Published: 8 August 1977
PDF: 6 pages
Proc. SPIE 0100, Developments in Semiconductor Microlithography II, (8 August 1977); doi: 10.1117/12.955357
Show Author Affiliations
John W. Bossung, The Perkin-Elmer Corporation (United States)


Published in SPIE Proceedings Vol. 0100:
Developments in Semiconductor Microlithography II
James W. Giffin, Editor(s)

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