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Proceedings Paper

Overview Of Advances In Photomask Substrate Flatness Requirements And Flatness Measurement Techniques
Author(s): Raymond F. Leinen
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Paper Abstract

The continued demand by the integrated circuit industry for larger wafers and higher device densities has placed requirements in the photolithographic manufacturing system for "superflat" substrate glass. Superflat substrates are flatter than current master grades and are primarily used in projection printing. The accurate and consistent measurement of this glass as it relates to both the vendor/purchaser and the test/use situations is examined. This is accomplished through both an overview of the industry's status as well as specific measurement and computer generated data. The study concludes that while the industry objective of much flatter substrate glass is clearly established, the procedures and equipment used to measure this flatness have not, heretofore, been well defined.

Paper Details

Date Published: 8 August 1977
PDF: 6 pages
Proc. SPIE 0100, Developments in Semiconductor Microlithography II, (8 August 1977); doi: 10.1117/12.955356
Show Author Affiliations
Raymond F. Leinen, Corning Glass Works (United States)


Published in SPIE Proceedings Vol. 0100:
Developments in Semiconductor Microlithography II
James W. Giffin, Editor(s)

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