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Proceedings Paper

Infrared Imaging For Thermal Analysis Of Quality Control And Reliability Problems
Author(s): R. Paulson; J. Barney; R. F. Leftwich; R. Friedman
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Paper Abstract

Infrared imaging devices can be used to view thermal characteristics in real time and to solve a wide variety of problems. An infrared microscanner originally introduced at SPIE in 1972 is shown applied to produce infrared signatures of beam lead devices . A number of other applications using other scanning techniques are also presented, including the examination of heat pipes, coatings, hybrid circuits and coils. Methods of using these thermal images in solving quality control and reliability problems are discussed.

Paper Details

Date Published: 20 October 1975
PDF: 6 pages
Proc. SPIE 0060, Solving Quality Control and Reliability Problems with Optics, (20 October 1975); doi: 10.1117/12.954390
Show Author Affiliations
R. Paulson, Lockheed Missiles & Space Company, Inc. (United States)
J. Barney, Lockheed Missiles & Space Company, Inc. (United States)
R. F. Leftwich, Barnes Engineering Company (United States)
R. Friedman, Barnes Engineering Company (United States)


Published in SPIE Proceedings Vol. 0060:
Solving Quality Control and Reliability Problems with Optics
Juan J. Amodei; Harry N. Lowell, Editor(s)

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