Share Email Print
cover

Proceedings Paper

Projection Printing
Author(s): R. M. Finnila; S. C. Su; A. I . Braunstein
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Many advantages in using projection mask alignment for the fabrication of integrated circuits include (1) the elimination of mask wear which allows a single plate to be used indefinitely and therefore justifies the added expense of obtaining defect-free masks, (2) greatly reduced defect densities in the photoresist patterns on the silicon wafers when compared with contact alignment methods, (3) better alignment accuracy in a projection aligner than with contact or proximity methods because the mask and wafer patterns are simultaneously in the focal plane of the alignment optics and there is no movement of the mask or wafer between alignment and exposure, and (4) higher resolution patterns on wafers by employing reducing optics.

Paper Details

Date Published: 1 March 1974
PDF: 8 pages
Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974); doi: 10.1117/12.954252
Show Author Affiliations
R. M. Finnila, Hughes Research Laboratories (United States)
S. C. Su, Hughes Research Laboratories (United States)
A. I . Braunstein, Hughes Research Laboratories (United States)


Published in SPIE Proceedings Vol. 0055:
Technological Advances in Micro and Submicro Photofabrication Imagery
William Converse; J. M. Graf, Editor(s)

© SPIE. Terms of Use
Back to Top