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Proceedings Paper

Locating Short Circuits on Populated Circuit Packs Using Computerized Color Thermography
Author(s): R. E. Maltzman; S. P. Carter
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Paper Abstract

The complexity of an average electronic circuit pack in industry today has increased immensely in the last several years. The use of surface-mounted devices (SMD) and multilayer circuit packs are the rule, rather than the exception. This acceleration in circuit pack complexity has driven the need for better circuit pack testing. Improvements in design for test (DFT), built-in self-test (BIST), and in-circuit test (ICT) have all contributed to higher yields of electronic circuit packs at the stage where they are first tested following assembly. The percentage of packs to be analyzed is dropping rapidly. Conversely, the task of locating the fault on the population of circuit packs which do have short circuits at this stage has become correspondingly more difficult. In addition, the density of components on the circuit packs has made it more attractive to troubleshoot rather than junk these circuit packs. A technique utilizing computerized color thermography (CCT) has been adopted to physically locate short circuits on these circuit packs. This paper deals with the practical use of CCT at a facility which manufactures and tests populated electronic circuit packs.

Paper Details

Date Published: 21 March 1989
PDF: 6 pages
Proc. SPIE 1094, Thermosense XI: Intl Conf on Thermal Infrared Sensing for Diagnostics and Control, (21 March 1989); doi: 10.1117/12.953394
Show Author Affiliations
R. E. Maltzman, AT&T Network Systems (United States)
S. P. Carter, AT&T Network Systems (United States)


Published in SPIE Proceedings Vol. 1094:
Thermosense XI: Intl Conf on Thermal Infrared Sensing for Diagnostics and Control
Gregory B. McIntosh, Editor(s)

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